last modified 02/03/2006

Coursecode: wb1442
Coursename: Introduction to Microsystems

ECTS creditpoints: 3

Faculty of Mechanical Engineering and Marine Technology
Lecturer(s): Goosen, J.F.L. , Guest lecturers

Tel.: 015-27 86500

Catalog data:
Microsystems technology, MEMS, micromachining, sensors and actuators, integrated optics, fabrication technolgy.

Course year: MSc 1st year
Period: 1A / 1B
Hours p/w: 2
Other hours:
Assessment:
written
Assessm.period(s): 1B
(see academic calendar )

Prerequisites: --
Follow up: --
Detailed description of topics:
This lecture gives and introduction to Microsystems with typical sizes up to 1mm and feature sizes of a few micrometers. Overview of applications such as sensors, actuators, structural components and signal conversion. An overview of manufacture techniques, reliability, modeling, etc. relevant to microsystem design. Furthermore the physics involved in such small systems and how this differs from systems of a more traditional scale.
Course material:
Handouts during lecture
References from literature:
Remarks (specific information about assesment, entry requirements, etc.):
Goals:
The student must be able to:
  1. list the applications of micro systems and describe their weak and strong points

  2. use scaling laws to calculate and predict behaviour of specific micro systems and compare and evaluate different concepts and systems when subjected to miniaturization

  3. describe several basic mechanical, electrical, magnetic, optical, thermal and fluidic principles, calculate how some these effects scale and explain how they are used in micro systems

  4. list and describe the basic manufacturing techniques used for micro systems and their specific strengths and weaknesses

  5. design a basic manufacturing sequence resulting in a specific structure using photolithography and micromachining process steps

  6. describe the problems involved in the assembly of these very small systems and explain how some of these can be solved

  7. list the functions of a package, several packaging solutions and describe the problems associated with packaging related to specific micro system needs

  8. describe the difficulties in testing and measuring of micro systems and the special equipment and structures involved in this

  9. list and describe some of the most common failure mechanisms of micro systems and how they can be influenced

  10. describe the difficulties involved in the design of micro systems and list the tools available to assist in this process

  11. compare different possibilities of physical principles, manufacturing techniques, packaging options, etc. in a specific micro system and/or situation and formulate a choice

Computer use:
Laboratory project(s):
Design content:
Special design requirements of microsystems.
Percentage of design: 50%