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This concerns a Course |
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In the program of MSc Mechanical Engineering and
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EC (European Credits): 2(1 EC concerns
a work load of 28 hours) |
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Faculty of Mechanical, Maritime and Materials Engineering |
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Department of Precision and Microsystems Engineering |
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Lecturer 1: Ir. W.D. van Driel |
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Lecturer 2: Prof. Dr. G.Q. Zhang |
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Catalog data:
Introduction to (advanced) wafer technology, microelectronic packaging and assembly, design and
reliability qualification. |
Course year: |
MSc 1st year |
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Course language: |
English |
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In case of
Dutch: Please
contact the lecturer about an English alternative, whenever needed. |
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Semester: |
2B |
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Hours per week: |
4 |
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Other hours: |
0 |
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Assessment: |
Written exam |
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Assessment period: |
2B |
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(see academic
calendar) |
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Prerequisites (course codes): |
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Follow up (course codes): |
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Detailed description of topics:
As the bridge between IC and various
electronics systems, microelectronic packaging controls more than 90% of the size, 60% of the cost, and largely the
system performance and reliability. It is one of the most fascinating and
rapid developing technology and business fields of Semiconductors. Due to the
recent progress of Cu/Low-k CMOS and advanced SiP technologies, microelectronic
packaging is playing a dominant role in the development of future
microelectronics and Microsystems.
Course outline:
- Application needs (Ambient Intelligence drives) for Semiconductors
- Technology and business development trends of Semiconductors
- Overview of advanced CMOS process technologies (including Cu/Low-k),
and advanced packaging technologies (covering the packaging glossary, design
specification, materials and properties, process flows and process
characteristics for both peripheral and Area Array interconnects, etc.)
- Designing and qualification of advanced packages (QFN, BGA,
FlipChip, CSP, WLP, three level SiP)
- Emerging packaging technologies, such as Cu/low-k packaging,
Nanopackaging, MEMS packaging, opto-packaging
and Bio-packaging
- Second level assembly
- International technology roadmap and future packaging perspectives
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Course material: |
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References from literature: |
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Remarks assessment, entry
requirements, etc.:
Three
possibilities of course assessment: 1) participating in real and mini
industrial R&D project team, 2) conducting literature study, 3) oral
examination |
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Learning goals:
To master the knowledge of advanced packaging
technologies, via learning the basics and critical aspects of designing and
qualification of advanced packages; knowing the technology roadmap, future
perspectives and business trend of advanced packaging. |
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Computer use: |
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Laboratory project(s): |
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Design content: |
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