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modified:
Course
name: Virtual prototyping and qualification of microelectronics
and Microsystems |
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This concerns a Course |
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In the program of MSc Mechanical Engineering |
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EC (European Credits): 3(1 EC concerns
a work load of 28 hours) |
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Faculty of Mechanical, Maritime and Materials Engineering |
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Department of Precision and Microsystems Engineering |
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Lecturer 1: Prof. Dr. G.Q. Zhang |
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Lecturer 2: Ir. W.D. van Driel |
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Catalog data:
Virtual prototyping and qualification,
designing for reliability, thermo-mechanical and multi-physics modeling, simulation-based optimisation. |
Course year: |
MSc 1st year |
Course language: |
English |
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In case of
Dutch: Please
contact the lecturer about an English alternative, whenever needed. |
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Semester: |
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Hours per week: |
4 |
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Other hours: |
0 |
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Assessment: |
Presentation |
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Assessment period: |
2A |
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(see academic
calendar) |
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Prerequisites (course codes): |
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Follow up (course codes): |
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Detailed description of topics:
The technology trends of microelectronics and microsystems are mainly characterized by miniaturization
down to nanoscale, increasing levels of technology
and function integration and introduction of new materials, while the
business trends are mainly characterized by cost reduction, shorter time to
market, and outsourcing. Combination of these trends leads to increased
chances and consequences of failures, increased design complexity,decreased product development and qualification
times, dramatically decreased design margins, and increased difficulties to
meet quality, robustness and reliability requirements.
Most importantly, for the
new product/process development, trial-error based design methods are still
the common practice, while reliability qualification methods are still
empirical. This situation, however, is becoming the bottleneck for the future
development, especially for the advanced Cu/Low-k CMOS and higher level SiP technologies. To achieve competitive product/process
development, it is vital to know and to apply the state-of-the-art of virtual
prototyping and qualification.
Course outline:
• Major reliability problems in Semiconductors industries
• Status quo of current
reliability paradigm
• The state-of-the-art of virtual prototyping and qualification,
including the basic theories and methodologies
• Case study of covering important failure modes related with wafer
backend, IC packaging and board level
assembly, such as (not limited to):
– Various cracks, and delamination
– Wire bonding failures
– Solder fatigues
– Moisture-induced failures
– Warpage
• Challenges and future perspective |
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Course material: |
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References from literature: |
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Remarks assessment, entry
requirements, etc.:
Two possibilities of course assessment: 1)
participating in real and mini industrial
R&D project team, 2) conducting literature study. |
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Learning goals:
To know the current and expected reliability
problems of and industry's concern for Microelelctronics
and Microsystems; to master the state-of-the-art of theories, methodologies
and industrial practices of virtual prototyping and qualification, in
combination with some real industrial case studies; to know the challenges and
future perspectives of virtual prototyping and qualification. |
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Computer use: |
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Laboratory project(s): |
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Design content: |