last modified: 05/01/2006

Course code: wb5434-05

Course name: Micro-assembly, packaging and test

This concerns a Course

In the program of  MSc Mechanical Engineering and MSc Electrical Engineering

EC (European Credits): 3(1 EC concerns a work load of 28 hours)

Faculty of Mechanical, Maritime and Materials Engineering

Department of Precision and Microsystems Engineering

Lecturer 1: Dr. ir. M. Tichem

Tel.:  015 - 27 81603 / 86578

Lecturer 2: Dr. ing. M.A. Bartek

Lecturer 3:      

Catalog data:

Micro-products and (hybrid) MEMS, micro-assembly, packaging, reliability and test.

Course year:

MSc 1st year

Course language:

English

 

In case of Dutch: Please contact the lecturer about an English alternative, whenever needed.

Semester:

2A

Hours per week:

4

Other hours:

0

Assessment:

Written exam

Assessment period:

2A / August

(see academic calendar)

 

Prerequisites (course codes):

     

Follow up (course codes):

     

Detailed description of topics:

The course explains the basic principles of as well as the technology for the assembly and packaging of miniaturised products/systems. The products focused on originate both from the micro-mechanical engineering domain and from the semiconductor domain (MEMS and hybrid MEMS).

More specifically, the course addresses the following topics: classification of microsystems and the relation to assembly and packaging approaches; basic assembly principles and differences between macro-scale and micro-scale assembly; micro-part feeding; micro-part gripping; self-adjustment; batch assembly and packagig of hybrid MEMS; general packaging flows for IC packaging and MEMS packaging; packaging architectures (including SoC, MCM, SiP); bonding techniques; wafer-level packaging; reliability and test; packaging-induced failures.

Course material:

  • Reader
  • Handout (presentations)

References from literature:

  •      

Remarks assessment, entry requirements, etc.:

     

Learning goals:

Gain understanding of a certain scope of micro-products (micro-mechanical systems and (hybrid) MEMS) and the approach to assembly and packaging of these systems.

Gain knowledge on micro-assembly and packaging technology, in order to be able to develop micro-assembly and packaging processes.

Computer use:

0%

Laboratory project(s):

     

Design content:

25%