DeMaMech: EU-Japan Collaboration in Higher Education Student Exchange Program

Offer of Research Topic

Offer from	University	The University of Tokyo
	Faculty/Department/Institute	Department of Precision Engineering
	Group Name	Microsystem Integration and Packaging
Research Theme		Study on optical hybrid Integration
Brief Explanation		Microassembly and packaging of MEMS (Micro-Electro-Mechanical Systems) are key issues for realizing next generation information systems. In particular, we are studying the room temperature bonding, optical surface mounting, and wafer-level packaging for highly functional optical devices. These applications include opto-electronic integrated circuits (OEIC), optical MEMS, and optical microsensors.
Research Steps		1. Literature survey 2. Learn how to use the experimental apparatus 3. Experimental demonstration 4. Analysis of experimental results
Period		10 months, but 5 months is also possible
Necessary Background, Knowledge, Skills		Interest in microassembly and packaging Fundamental knowledge about measurements.
Further Information		http://www.su.rcast.u-tokyo.ac.jp/index.html
Contact Person		Prof. Dr. Eiji Higurashi(eiji@su.rcast.u-tokyo.ac.jp)